Job Brief
Highly experienced, hands-on Senior Product Engineer to lead product engineering activities for advanced System-on-Chip (SoC) devices integrating Resistive RAM (ReRAM) technology.
Job Description
- Product Ownership: Lead product engineering activities from first silicon evaluation and characterization through qualification, production ramp, and high-volume manufacturing
- Silicon Characterization: Define and execute characterization plans covering electrical parameters, PVT corners, memory functionality, performance, and operating margins
- NVM Engineering: Analyse switching, endurance, retention, speed, performance etc
- Yield Engineering: Monitor wafer-sort and final-test yield, identify systematic and random failures, perform statistical analysis, and drive yield improvement programs
- Test Engineering: Develop and optimize wafer-sort and final-test methodologies, test coverage, guard bands, screening algorithms, and production test limits
- Reliability Support: Support product qualification, reliability characterization, stress testing, and failure mechanisms analysis, including ECC effectiveness and memory error behavior
- Data Analytics: Use statistical and automated data-analysis methods to identify trends, correlations, outliers, and opportunities for continuous product improvement
Required Skills and Experience
- Sc. or M.Sc. in Electrical Engineering, Electronics, Physics, or a related technical discipline
- At least 10 years of hands-on semiconductor Product Engineering experience at R&D/Design/Fabless Center, including silicon characterization, product testing, yield analysis, and volume-production support
- Strong understanding of semiconductor device physics, CMOS technology, and electrical failure mechanisms
- Experience with ATE environments, wafer probing, final testing, silicon debug, and test-data analysis
- Strong analytical capabilities, including statistical techniques, Python, JMP, or equivalent tools
- Demonstrated ability to independently lead cross-functional technical investigations and resolve complex product issues
- Excellent technical communication and problem-solving skills
Nice to have
- Proven experience with complex digital/mixed-signal SoCs, embedded memories, or non-volatile memory products
- Direct experience with ReRAM/RRAM, Flash, EEPROM, MRAM, or other embedded NVM technologies
- Understanding of memory-array architecture, sensing, ECC, BER analysis, and memory redundancy
- Knowledge of JEDEC/AEC-Q100 qualification requirements and semiconductor reliability methodologies
- Experience with characterization automation, test program optimization, and yield-management systems
- Previous experience introducing semiconductor products into high-volume manufacturing
Ideal Candidate
A technically strong, proactive, and independent engineer with a proven track record of solving complex silicon and manufacturing problems. The ideal candidate combines deep semiconductor product-engineering expertise, data-driven problem-solving, and a solid understanding of embedded memory technologies, with the ability to drive improvements from initial silicon to stable, high-yield production. Apply now